Multibeam Corp. has introduced the MB platform, a Multicolumn E-Beam Lithography (MEBL) system that aims to revolutionize chip factories and bring a renaissance to lithography technology. This system, designed for mass production, offers fully automated precision-patterning technology that can be used for various applications such as rapid prototyping, advanced packaging, high-mix production, chip ID, and compound semiconductors.
The order from SkyWater Technology, a company that builds both defense and commercial applications in the US, validates Multibeam’s readiness to bring about significant improvements in chip fabrication. According to Multibeam’s CEO and chairman, David K. Lam, their technology could make certain parts of chip fabrication 100 times more productive than current systems.
The introduction of the MB platform is part of Multibeam’s plan to keep Moore’s Law going. Moore’s Law, named after Intel’s Gordon Moore, states that the number of components on a chip could double every couple of years. However, upholding Moore’s Law has become more challenging in recent years. While innovations in 3D packaging have improved performance and interconnections, these chips are often larger than before, and the cost of building the latest chip factories can reach $20 billion.
To address these challenges, Multibeam developed the MB platform over the past seven years. This platform leverages multiple miniature columns operating in parallel to achieve maximum accuracy, quality, and speed. It offers more than 100 times greater throughput than conventional EBL systems, making it the highest productivity high-resolution maskless lithography system available.
Multibeam’s platform has several advantages over traditional EBL systems. It was designed for volume production and offers auto wafer loading and alignment, automated vacuum recovery, and a speedy column replacement process. It is a mask-less lithography solution that enables faster development of designs and greater IC design flexibility. Additionally, the system has a compact footprint, lower power requirements, and modular design for easy scalability.
The launch of the MB platform marks Multibeam’s shift from the development stage to becoming a producer of high-productivity Multicolumn E-Beam Lithography systems. This is significant as Multibeam becomes the sole domestic US supplier of EBL technology, which is crucial in an era of geopolitical competition between nations.
The MB platform is expected to enable applications at advanced nodes and drive a new technology inflection called “advanced integration.” Chipmakers can achieve improvements in chip-to-chip power, bandwidth, and latency, comparable to on-chip interconnects. Multibeam is confident that their lithography solution will help chipmakers seize profitable new market opportunities.
In conclusion, Multibeam’s introduction of the MB platform has the potential to revolutionize chip fabrication and uphold Moore’s Law in the face of challenges. Their innovative approach to lithography technology offers higher productivity, greater flexibility, and cost-effective solutions for advanced packaging and IC innovation. With their focus on volume production and protection through patents, Multibeam is set to make a significant impact in the semiconductor industry as the sole US supplier of EBL technology.